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RIBE-5型反应离子束刻蚀机
Reactive Ion Beam Etching Machine, RIBE-5
【摘要】 反应离子束刻蚀技术是近年来发展起来的一种微细加工技术,它利用反应离子束轰击团体表面时发生的溅射效应和化学反应剥离加工工作上的几何图形。具有极高的分辨率,能够控制槽深和槽壁角度,表面应力小。反应离子束刻蚀技术已有效地用于研究和制造大规模和超大规模集成电路,声表面波器件,磁泡存储器,微波器件,集成光路,超导器件,闪烁光栅等。本文叙述了一台RIBE-5型反应离子束刻蚀机的工作原理、结构特点、技术性能和刻蚀工艺实验结果.
【Abstract】 Reactive ion beam etching process is one of the ultrafine machining techniques which have been rapidly developed in recent years. Patterns on the working pieces are made by sputtering effects and chemical reaction which occur when reactive ion beam bombard the solid surface. The patterns etched are of high resolution,and the groove depth and groove wall angle can be controlled with less surface stress. Reactive ion beam etching technique has been effectively used to study and fabricate large-scale and ultra large scale integrated circuit, acoustic surface wave device, magnetic bubble device microwave device, integrated optical circuit, superconducting device,shimmer optical pattern etc. The paper give detail, description.
- 【文献出处】 真空 ,Vacuum , 编辑部邮箱 ,1993年01期
- 【被引频次】4
- 【下载频次】217