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半导体器件工艺中干法刻蚀技术的进展
ADVANCE OF DRY ETCHING TECHNIQUE IN SEMICONDUCTOR DEVICE FABRICATION
【摘要】 本文首先对干法刻蚀技术发展的二十余年作了回顾。列举一些对本技术发展带有突破性意义的里程碑,并叙述干法刻蚀技术在微电子学和光电子学等重要应用领域的作用。在发展动向方面介绍了电子迴旋共振和线圈耦合等离子体等刻蚀技术的新进展,以及主干道式和集团式的多工艺真空联机系统设备设计的新结构。突出说明干法刻蚀技术今后的发展是多样化的,而且仍然方兴未艾。
【Abstract】 progress in the development of dry etching in more than 20 years is reviewed. Some milestones symbolizing significant events in the course of development are described. Applications in major fields of electronics and optoelectronics are also mentioned. For development trend, techniques such as electron cyclotron resonance and transformer coupled plasma are introduced as newly emerged ones. As new structural designideas, the mulli-chamber all-vacuum-inline system and cluster systems are also introduced. The paper goes to the end with emphasizing that dry etching technique will be diversified and just unfolding.
- 【文献出处】 微细加工技术 ,Microfabrication Technology , 编辑部邮箱 ,1993年03期
- 【被引频次】21
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