节点文献
薄膜厚度测量技术
THIN FILM THICKNESS MEASUREMENT TECHNIQUES
【摘要】 随着各种表面沉积技术(PVD、CVD)日益广泛地应用于微电子、光学及超导薄膜沉积等微细加工领域,膜厚在10—10~2nm范围内的薄膜厚度测量技术也不断得到发展。本文系统地描述了各种测量技术的原理、属性及测量方法,并对其测量精度及适用范围进行了比较。
【Abstract】 While a variety of film deposion techniques (PVD,CVD) gained a wide use in the field of microprocess such as eletronic, optical and super-conductor film deposition, measurement techniques of film thickness which is in the range of 10~104nm are being developed. The principles and measurement methods of these techniques are presented in this paper. Their accuracies and application fields are compared as
- 【文献出处】 微细加工技术 ,Microfabrication Technology , 编辑部邮箱 ,1993年01期
- 【被引频次】10
- 【下载频次】644