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n型砷化镓微区光电化学腐蚀过程
PHOTOELECTROCHEMICAL MICROETCHING OF n-GaAs
【摘要】 在n-GaAs电解液界面,用聚焦He-Ne 激光照射,使n-GaAs 表面发生微区光电化学腐蚀,用计算机控制步进马达,使试样在X-Y二维方向扫描移动,能在晶片上得到刻蚀点直径2μm 的刻蚀图案.研究了激光相对光强,KOH、H2SO4、KCl 等刻蚀剡的浓度,光腐蚀的时间,电极电位等因素对腐蚀点的直径和深度的影响,通过实验数据找出腐蚀过程的规律,并用光电化学原理进行解释.
【Abstract】 Microphotoelectrochemical etching of n-GaAs by focused He-Ne laser was inven-stigated.An etched pattern was scribed on the n-GaAs surface while the sample movedin X-Y two directions by means of two motors controlled by microcomputer.Thediameter of the etched holes was 2μm.The intensity of the laser light,the concen-trations of different etchants,such as KOH,H2SO4,HCl and KCl etc.,the etchingtime,the electrode potentials effected the diameters and depths of the etched holes.The experiment results were discussed and analyzed in this paper.
【Key words】 Photoelectrochemical etching; Microetching of semiconductor; Photoassisted microetching; Non-mask etch of n-GaAs;
- 【文献出处】 物理化学学报 ,Acta Physico-chimica Sinica , 编辑部邮箱 ,1993年03期
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