【摘要】 利用自制小型真空扩散接合装置研究了铜与45钢的扩散接合,并对接合区的原子迁移行为及组织和硬度变化进行了分析。结果表明:铜与45钢实现扩散接合的最佳工艺参数为:T=800～850℃,p=3MPa,t=15～30min。更多还原

【Abstract】 By using small unit of Vacuum diffusion bonding the diffusion bonding of copper and carbon steel 45(carbon 0.45%) has been studied. The transition of atoms in bonding zone, the changing of microstructure and hardness in bonding zone have also been analyzed. The results show that the optimum parameters for diffusion bonding of Copper and carbon steel 45 are as follow: T=800～850℃, P=3MPa, t=15～30min.更多还原