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印制电路板的刻蚀及刻蚀液电解再生的闭路循环工艺研究
ETCHING PRINTING OF CIRCUIT BOARDS AND ELECTROLYTIC REGENERATION OF SPENT CUPRIC CHLORIDE ETCHANT
【摘要】 本文研究用氯化铜溶液刻蚀和隔膜电解法再生废液两大步骤。在刻蚀过程中,氮化铜刻蚀液中的[Cu+]/[Cu2+]比值不断升高,活性减小。将活性降低了的刻蚀废液引入隔膜电解槽电解,一价铜离子在阳极上氧化为Cu2+,降低了废液中[Cu+]/[Cu2+]比值,并在阴极上还原沉积出金属铜而减少了废液中的总铜含量,使溶液活性提高而得到再生。与此同时,已获得再生的刻蚀液连续不断地返回到刻蚀槽,从而形成了无排放的闭路循环系统。
【Abstract】 The technological process described in this paper includes two mainsteps—the etching printing of circuit board with cupric chloride solutionand the membrane-electrolytic regeneration of spent etchant.In the courseof etching,the ratio of [Cu+]/[Cu2+] in cupric chloride etchant incessantlyrises,and the activity of the etchant decreases.Under this condition,if thespent etchant is led into a membrane-electrolyzer,the cupric ions Cu+ wouldincessantly be transformed into cupric ions Cu2+ by oxidation on the anode,and the ratio of [Cu+]/[Cu2+] in the spent etchant is gradually diminished.At the same time the total copper content in the spent solution is also dim-inished as a result of the reduction of Ca+ to metal on the cathode.So thespent etchant is regenerated,and the regenerated etchant into the etchingpool as etchant,the undrained closed-cycle system is formed.The conditions for etching and membrane-electrolysis were investigated.The results show that the efficiency of membrane-electrolysis is mainly det-ermined by ions ratio [Cu+]/[Cu2+] in the catholyte,and the cell voltage isrelated to this ions ratio in the anolyte.Therefore,the ratios [Cu+]/[Cu2+]in the catholyte and anolyte have to be controlled in the closed-cycle systemfor achieving a good effect in this membrane-electrolysis regeneration process.
【Key words】 printed circuit board; etching; electrolytic regeneration of spent etchant;
- 【文献出处】 水处理技术 ,Technology of Water Treatment , 编辑部邮箱 ,1992年06期
- 【被引频次】4
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