节点文献
复合厚膜NTC热敏电阻材料的研究
THE RESEARCH ON COMPLEX THICK FILM NTC THERMISTOR MATERIAL
【摘要】 本文研究了一种新型复合厚膜 NTC 热敏电阻材料。这种材料是由负温度系数热敏半导体陶瓷(简称 NTC 热敏半导瓷)、硼硅酸铅系玻璃粉和适量的导体粉末(银粉)组成的三成份体系复合材料。与由 NTC 热敏半导瓷一玻璃粉组成的常规二成份体系相比,用这种复合材料制成的厚膜 NTC 热敏电阻器的性能更优良。文中通过电阻器的微观结构及其等效电路,较好地解释了材料结构与性能的关系。
【Abstract】 A new complex thick film NTC thermistor material consisting of NTG semiconductor ceramic,B-Si-Pb glass and proper amount of Ag powder is studied in this paper.This complex ther-mistor has excellent characteristics more than that made the NTC semiconductor ceramic and glass powder.In addition,with the study of microstructure and the equivalent circuit of the complex thermis-tor,the relationship between the structure and the properties of material are explained.
- 【文献出处】 华南理工大学学报(自然科学版) ,Journal of South China University of Technology(Natural Science Edition) , 编辑部邮箱 ,1992年02期
- 【分类号】TN307.1;
- 【被引频次】1
- 【下载频次】138