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陀螺仪壳体钎焊软钎料润湿性研究
Study on Wettability of Soft Solder in Gyro- Housing Soldering
【摘要】 本文用润湿角和动态润湿性就熔点低于150℃的软钎料的润湿性进行了研究。研究结果对陀螺仪壳体的钎焊工艺具有指导意义。
【Abstract】 The wettability of soft solder, the melting point of wich is below 150℃, is studied through wetting angle and dynamic wettability in this paper. The results obtained have instructive function for brazing technology of gyro housing.
- 【文献出处】 航空工艺技术 , 编辑部邮箱 ,1992年06期
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