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分子束外延中的掺硼工艺

Homoepitaxial Boron Doping in Silicon Molecular Beam Epitaxy

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【作者】 杨小平; 蒋维栋; 樊永良; 盛篪; 俞鸣人; 李炳宗;

【Author】 Yang Xiaoping/Surface Physics Laboratory,Fudan University,Shanghai,200433Jiang Weidong/Surface Physics Laboratory,Fudan University,Shanghai,200433Fan Yongliang/Surface Physics Laboratory,Fudan University,Shanghai,200433Sheng Chi/Surface Physics Laboratory,Fudan University,Shanghai,200433Yu Mingren/Surface Physics Laboratory,Fudan University,Shanghai,200433Li Bingzhong/Electronic Engincering Department, Fudan Universitv, Shanghai,200433

【机构】 复旦大学应用表面物理国家重点实验室; 复旦大学电子工程系 上海200433; 上海200433; 上海200433;

【摘要】 我们在硅分子束外延中利用共蒸发B2O3的方法在硅中进行硼掺杂,掺杂浓度可控制在4×1017cm-3至4.2×1019cm-3之间,这说明不需要利用离子注入或高温掺杂炉,也可以在硅外延层中实现有效的P型硼掺杂.我们还对掺杂外延层的质量进行了初步分析:外延层剖面均匀、没有明显的偏析现象;当硅源速率在 2A/s时,外延层中氧含量与衬底相同.

【Abstract】 Boron doping has been realized in silicon molecular beam epitaxy using B2O3 source withthe usual Knudsen cell without using a special high temperature cell or low energy ion implan-tation technique. Carrier concentration can be controlled in the range from 4×1017cm-3 to 4×1019cm-3 by changing the crucible temperature. The carrier profile achieved by Knudsen cellshutter opening and closing was sufficiently steep demonstrated by the result of extended resisti-vity. The oxygen concentration in the epitaxial film depends on the evaporation rare of silicon.When silicon evaporation arte was 0.2nm/s, the oxygen concentration in the epitaxial film wasthe same as in the substrate.

  • 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1992年10期
  • 【被引频次】2
  • 【下载频次】41
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