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集成电路塑封应力的压阻测试

Study on Piezoresistive Test Pattern for IC Stress Introduced by Plastic Encapsulation

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【Author】 Chen Jian/Department of Electronic Engineering,Fudan UniversityBao Minhang/Department of Electronic Engineering,Fudan UniversityHu Chengyu/Department of Electronic Engineering,Fudan UniversityLi Shanjun/Institute of Material Science,Fudan University,Shanghai,200433Xie Jingwei/Institute of Material Science,Fudan University,Shanghai,200433Zheng Guorong/Circuit Department of Shanghai No.7 Radio Factory

【机构】复旦大学电子工程系；复旦大学材料科学研究所；上海无线电七厂电路车间上海200433 上海半导体研究所；上海200433；上海200433；

【摘要】本文提出了一种用于测量集成电路塑封附加应力的十字型压阻测试图形设计,用它可同时测量芯片平面内的两个正应力及剪切应力,比现有的几种方法更加合理可靠.用这种测试器件对国产塑封料和进口塑封料进行了对比应力测试,所得结果为国产塑封料配方及塑封工艺的改进提供了性能参数.更多还原

【Abstract】 A four-terminal piezoresistive test pattern for the measurement of attached stress intro-duced by IC plastic encapsulation is reperted. The normal stresses T1 and T2 as well as the shearstress T6 can be obtained simultaneously. The test results are important for improving the for-mula of plastic material and the moulding process in VLSI encapsulation.更多还原

【关键词】压阻；测试图形；附加应力；封装形式；后固化；应力测试；粘片；测试方法；十字型；剪切应力；

【文献出处】半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1992年06期

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