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再冷压Bi系块材晶粒连接性质的改善
IMPROVEMENT OF INTERGRAIN BOUNDARIES IN THE RE-COLD PRESSED Bi-BASED BULK MATERIAL
【摘要】 通过再冷压过程制备了单相(Tco=106K)Bi1.80Pb0.34Sr1.86Ca2Cu3块材,和常规烧结的Bi系块材(SR)相比,再冷压块材(RCP)具有更明显的沿C轴取向和较高的体积密度。LN2温度测量表明,零场下RCP块材的临界电流密度(JC)普遍高于1000A/cm2,最好的结果高达~4000A/cm2,这远大于SR块材的JC(~300A/cm2)值。SR块材的JC和磁场的关系遵从JC~H-0.9,而对RCP块材JC~H-0.56。这表明前者是由于磁场破坏了颗粒间弱耦合的Josephson连接所致,而后者非常接近由磁通蠕动模型所预言的结果(JC~H-0.5),这意味着影响RCP块材JC的主要原因是沿着类似于晶粒内部晶界的边界磁通蠕动。
【Abstract】 The Bi1.8Pb0.84Sr1.88Ca2Cu3Oy bulk material of high-Tc single phase(T0 = 106K) was prepared by re-cold pressing process. The re-cold pressed Bi-based bulk material(RCP) has more obvious orientation along the c-axis and higher volume density compared with the sintered bulk material(SR). Measurements show that the transport current density Jc at 77K and zero field is generally higher than l000A/cm2 and the best result is as high as 4000A/cm2, which is far higher than that of SR(Jc-300A/cm2). A dependence of Jc-H-0.9 for SR is observed, indicating that the sharply decrease of Jc with field for SR is due to field-quenching of weak-coupling intergr ain Josephson junction. While for RCP, a dependence of Jc-H-0.58 is obtained, which is almost compatible with that predicted by flux creep model(Jc-H-0.5). This fact means that Jc of RCP is mainly limited by flux creep along the boundaries similar to the internal boundaries in grain.
- 【文献出处】 低温与超导 ,Cryogenics and Superconductivity , 编辑部邮箱 ,1991年04期
- 【被引频次】1
- 【下载频次】15