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硅中氧的结构组态及热扩散行为
Configuration and Thermal Diffusion of Oxygen in Silicon
【摘要】 利用变温FTIR测量和变温Hall效应测量方法,探讨了在室温(RT)至475℃温度范围内,硅中9μm峰的中心位置及其红外吸收系数随温度变化的规律.实验证实了氧在硅单晶中存在二种不同的组态:在RT—325℃范围内为Si2O组态,其束缚能为Eb~0.8—1.0eV;在325—475℃范围内,Si2O组态和准自由间隙氧原子组态同时并存,准自由氧原子扩散所须克服硅晶格的势垒为EL~1.5—1.6eV.由此很好地解释了硅中氧的热扩散行为.
【Abstract】 The central position and the absorption coefficient of 9μm band of Si samples are studiedih the temperature range from RT to 475℃ by FTIR spectrometry and Hall coefficient tech-niques.Experimental results show that there exist two kinds of oxygen configuration in sili-con: In the temperature range fran RT to 325℃, the oxygen atoms are kept as bonded Si2Oconfiguration with a binding energy of Eb~0.8-1.0 eV;In the temperature range from 325to 475℃, the bonded Si2O configuration and the quasi free interstitial oxygen configuration coe-xist.The lattice barrier EL is~1.5-1.6 eV.
- 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1991年08期
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