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膜与底材结合力的声发射研究
INVESTIGATION ON THE BINDING FORCE BETWEEN FILM AND SUBSTRATE BY ACOUSTIC EMISSION
【摘要】 介绍用声发射监测刻划过程来测量膜与底材结合力的实验方法。用该方法能实时准确测量膜破坏的临界载荷,并且测量结果对工艺参数是敏感的。
【Abstract】 The experimental method of acoustic emission monitoring of scratch process for measuring binding force between film and substrate can be used for real-time determining of critical load of film and the measuring results are sensitive to technological parameters.
- 【文献出处】 无损检测 ,Nondestructive Testing , 编辑部邮箱 ,1990年05期
- 【分类号】TG174.4
- 【下载频次】15