【摘要】 <正> 金的耐蚀性、导电性及化学稳定性是电子元件、精密仪表和装饰等行业所需求的。但金的价格昂贵,硬度和耐磨性均较差。电镀工作者为得到金基合金把精力放到新电镀溶液的研究和开发上。 60年代后期发展起来的金镍合金,既保持了金的优点,又提高了金的硬度及耐磨性,减更多还原

【Abstract】 Using the prescription for plating Au-Ni alloy in solutions free from cyanide and technological condition studied by our laboratory the plating layer of Au-Ni alloy can be obtained, of which the Ni content by weight can be changed from 0 to 50% continuously. This paper emphasizes the influence of pH value, temperature, cathodic current density and ethylenediamine on quality of plating layer and alloy composition.更多还原