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溅射铜膜的闪烁噪声和表面粗糙度的关系

Correlation between the Flicker Noise and the Surface Roughness of Sputtered Copper Film

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【作者】 王曦郑耀宗阮刚王建伟

【Author】 H. Wang and Y. C. Cheng (Department of Electrical and Electronic Engineering, University of Hong Kong, Hong Kong) . G. Ruan and J. W. Wang (Department of Electronic Engineering, Fudan University, Shanghai).

【机构】 香港大学电机电子工程系复旦大学电子工程系复旦大学电子工程系

【摘要】 本文首次采用了金属膜的表面特征来研究金属膜的闪烁噪声。结果表明在二氧化硅和蓝宝石衬底上溅射的铜膜的表面特征及噪声行为都很不相同。粗糙不规则的表面对金属薄膜的闪烁噪声起重要作用。这种噪声的物理模型与MOS器件闪烁噪声的机构类似。

【Abstract】 The flicker noise of metal films prepared by sputtering of copper onto the oxidized silicon and sapphire substrates is studied by means of surface characteristics for the first time. The results show that the noise behaviour and the surface physics of the metal films on these two kinds of substrates are different from each other and that the roughness and irregularity of the film surface play an important role in generating the flicker noise of metal film. In addition, the physical model of the noise is similar to the flicker noise mechanism of MOS device.

  • 【文献出处】 电子学报 ,Acta Electronica Sinica , 编辑部邮箱 ,1990年06期
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