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高粘结性共聚酰亚胺
THE COPOLYIMIDE WITH IMPROVED ADHESION
【摘要】 采用非酮胺体系研究成高粘结性共聚酰亚胺。确定了适用体系为 OB′B,获得最佳粘结性的条件是原料中 B 占二元酐的60—75mol.-%,共聚酰胺酸的分子量5—7万和热亚胺化温度250℃。对共聚物再共混、溶剂和被粘物对粘结性的影响以及粘结性提高的主要原因也作了讨论。
【Abstract】 To improve adhesion of the polyimide(PI),the copolyamic acids(CPAA)were prepared,and an OB′B(ODA-BTDA-BOPDPA)was selected.The effects of com-ponents of monomers,molecular weight of CPAA and its blends,imidization temperature(Ti)as well as solvents on the imidization process in conversion from CPAA to copolyimide(CPI)and the bonding strength(S_b)of CPI has been investigated.It was found that the ad-hesion of CPI is highest whten content of monomer B is 60—75mol.-0/0,(?)w of CPAA is5—7×10~4and T_i is 250℃.The CPI from both CPAA blends shows higher adehesion thanfrom only CPAA.
【Key words】 increasing adhesion; copolyimide; blend; copolyamic acid; thermal imidization.;
- 【文献出处】 材料科学进展 , 编辑部邮箱 ,1990年05期
- 【被引频次】1
- 【下载频次】39