【摘要】 借助于透射电子显微镜（TEM）研究了Cu-Cr、Cu-Ti双层离子束混合。分别用200keVAr⁺和350keVXe⁺注入Cu-Cr、Cu-Ti双层薄膜,对其混合后的表面硬度和电阻进行了测量。发现Cu-Cr双层混合,在10¹⁷/cm²Ar⁺注入剂量时,TEM形貌图出现了沟纹,为一离子择优溅射效果,此时形成了单一的Cu基亚稳相固溶体,经200℃退火后,有孪晶生成,Cr沉淀析出,而Cu-Ti双层离子束混合有Cu₃Ti₂相生成,在400℃退火时生成了Cu₃Ti相。离子束混合的表面硬度和电阻都有了显著地增加。经100～400℃退火,其表面硬度和电阻的变化主要受退火前混合程度、热处理引起的相变及损伤程度的综合影响。更多还原

【Abstract】 Ion beam mixing of Cu-Cr Cu-Ti bilayer thin films was investigated by means of transmission electron microscopy （TEM）. The surfaee hardness electrical resistance of these films implanted respectively with 200 keV Ar⁺ and 350 keV Xe⁺ ion beams were measured. It is found that at a dose of 10¹⁷ Ar⁺/cm² grooved formation occurred in the micrograph of Cu-Cr mixing due to selective spattering, and single met astable solution based on Cu is formed, After annealing microtwin and Cr precipitates. Whereas Cu₃Ti₂ is formed in Cu-Ti bilayered mixing, Cu₃Ti formed by 400℃ annealing. The surface hardness and resistance of these films by ion mixing remarkable increaseel, After annealing at 100～400℃, these variations are mainly causeel by the resultant effects of the implantation before annealing, the phase transformation invoked by heat treatment and the recoverability from damage.更多还原