【摘要】 在高60cm,宽45cm 的模拟电子装置内,进行装置内热移动研究,得到不同条件下的温度分布及速度分布.在理论解析及数值计算基础上,进行无因次准数关联,得出实验式.实验结果及解析结果基本一致.利用所得实验式对正在运转或有待开发的新的电子装置有关参数进行推算,对于传热设计具有很强的实用性.更多还原

【Abstract】 The investigation of removing heat from electronic device using simula- tion printed board between the parallel plates with 60cm high 45cm wide has been carried out.The temperature and the velocity distribution in various conditions were obtained.Based on theoritical analysis and numerical calculation.The dimensionless unmbers and experimental expressions were obtained.It indicated that exprimental results agreed approximately with numerical analyses.It is possible to use the experimental expressions for evaluating the relating parameters of being operated and new developing electronic devices,therefore present expriment possesses determinate utility更多还原