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TiN镀膜的磨损与膜组织结构之间联系的电镜研究
ELECTRON MICROSCOPY STUDY ON RELATION BETWEEN WEAR-RESISTANCE AND MICROSTRUCTURE OF HCD ION-PLATED TiN FILM
【摘要】 利用透射电镜和扫描电镜,观察了经磨损试验后的Al合金基体上的TiN镀膜形貌以及破坏形式,并从镀膜的表面和横截面研究了镀膜的组织结构、相分布和组织分布。观察发现,TiN镀膜的表层是由细小的微晶组成;而横截面上是细柱状TiN晶体,其间存在着没有贯穿整个镀膜的微裂纹。TiN镀膜通过AlTi3化合物相过渡和基体Al合金结合。经磨损后的TiN镀层有片状剥落,存在大量和磨损方向平行或垂直的裂纹。镀膜层存在较大的内应力。分析认为微裂纹的存在影响镀膜的耐磨性,而内应力则导致了微裂纹的产生。讨论了微裂纹、内应力以及磨损性之间的联系,提出了改善镀膜性能的方法。
【Abstract】 With SEM and TEM, the morphology and microstructure of surface layer and cross-section of TiN film ion-plated on Al alloy substrate are studied. According to the observation, the TiN wearing film in surface layer consists of Polycrystals and of thin columnar crystals in cross-section. There are many microcracks among the columnar crystals, but they are not throughout the surface of film. There is an AlTi3 transitive zone between TiN film and Al alloy substrate. TiN film peels in flakes and a lot of cracks parallel to or perpendicular to the wearing direction can be observed through the wearing test. A large stress is measured in TiN film. Based on the observed results, it is considered the microcracksin TiN film affect the wear-re sistance and the stress induces the microcracks. The relation of stress, microcracks and wear-resistance has been discussed. The method for enhancing the film properties is given.
- 【文献出处】 理化检验.物理分册 ,Physical Testing and Chemical Analysis (Part A:Physical Testing) , 编辑部邮箱 ,1989年04期
- 【分类号】TG174.4;TG115.21
- 【下载频次】9