【摘要】 本文介绍了用半导体拉力传感器和大规模集成电路对表征伤口愈合程度的力学指标进行测量的方法,操作方便,测量迅速,稳定可靠,解决了医学科学中的一个测量问题。更多还原

【Abstract】 In this paper, we introduce a measuring method for the mechanical index of healing wound by using semiconductor and LSIC. The instrument performs fast, accurate and reliable measurement and is easily operated, as well as can be used to solve a series of measurement problems in the clinical medicine更多还原