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共溅射钨硅化合物真空快速热退火行为(英文)

The Behavior of Co-Sputtering Tungsten Silicide After Vacuum Rapid Thermal Annealing

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【作者】 陈存礼; 曹明珠; 蒋宏伟; 徐伟文; 华文裕;

【Author】 Chen Cunli, Cao Mingzhu, Jiang Hongwei and Xu Weiwen (Department of Physics, Nanjing University)Hua Wenyu (Department of Applied Physics, East China Institute of Technology)

【机构】 南京大学物理系; 华东工学院;

【Abstract】 The behavior of co-sputtering tungsten silicide after vacuum rapid annealing at 1000-1100℃ for 15s is investigated by Raman scattering, scanning electron microscope, X-ray diffraction, Auger electron spectrum and resistivity measurements. There are two Raman peaks at 331 and 450cm-1, and their intensities increase with the temperature rise of rapid thermal annealing. Scanning electron micrograph exhibits crystallization at 1000℃ and its enhancement with increase of annealing temperature. In addition to the (002), (101), (110), (103), (112) and (200) diffraction peaks of WSi2, there are some W5Si3 peaks in X-ray diffraction pattern. However, the composition of WSi2 is found in Auger electron spectrum at 1000℃, and the measurement results of sheet resistance also conclude WSi2 characteristics.

【关键词】 共溅射; 硅化合物; 快速热退火;
  • 【文献出处】 固体电子学研究与进展 ,Research & Progress of Solid State Electronics , 编辑部邮箱 ,1989年04期
  • 【下载频次】24
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