节点文献
减压硅外延的混合动力学分析
The Comprehensive Dynamic Analysis of Silicon Epitaxy under Reduced Pressure
【摘要】 本文讨论了减压情况下硅外延生长过程的动力学问题,用混合动力学模型分析了压力和温度等参数对生长速率和薄膜淀积厚度均匀性的影响,以及质量输运与表面反应控制相互转变特征,理论分析与实验结果吻合得较好。
【Abstract】 The kinetics of silicon epitaxial process under reduced pressure has been discussed in this paper. The influence of pressure and temperature on the growth rate and film thickness uniformity in reactor are analyzed by using a comprehensive dynamic model. It shows the transitive character from mass-transfer control to the surface reaction control. The results of theoretic calculation compaired with experimental are agreement well.
【关键词】 多参数模型;
质量输运模型;
表面反应模型;
减压硅外延;
【Key words】 multi-parameters model; mass-transport; surface reaction; silicon epitaxy under reduce pressure.;
【Key words】 multi-parameters model; mass-transport; surface reaction; silicon epitaxy under reduce pressure.;
【基金】 国家自然科学基金
- 【文献出处】 吉林大学自然科学学报 ,Journal of Jilin University , 编辑部邮箱 ,1988年04期
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