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Cu-Ti薄膜离子束混合的硬度及电阻性质的研究

An Investigation on the Surface Hardness and Electric Resistance in Cu-Ti Thin Films by Ion Beam Mixing

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【作者】 施立群杨乃恒李梅林孙树滋

【Author】 Shi Liqun, Yang Naiheng, Li Meilin and Shun Shuzi

【机构】 东北工学院真空教研室东北工学院应用物理教研室东北工学院应用物理教研室

【摘要】 分别给出了能量为350keV的Xe~+注入Cu/Ti双层(RT)和 Cu/Ti多层(LN)薄膜后的表面硬度和电阻的测量结果,研究了混合后的上述性质的时效效果,同时进行了TEM分析。研究结果表明:Cu/Ti离子束混合后的表面硬度和电阻都发生了变化,特别是硬度显著提高。经100—400℃退火后,其表面硬度和电阻的变化主要受退火前的混合程度、热处理引起的相变及损伤恢复程度的综合影响。

【Abstract】 Measurements of surface hardness and electric resistance of Cu-Ti bilayer and multilayer films, implanted with 350 keV Xe+ ion-beam, are presented to discuss the ageing effect on them with TEM analysis.The result indicates that both the surface hardness and resistance varied after implantation especially the remarkable increase in hardness. It is observed that after annealing at 100-400℃ these variations are mainly caused by the resultant effects of the implantation before annealing, the phase transformation invoked by heat treatment and the recoverability from damage.

【关键词】 表面硬度电阻离子束混合
【Key words】 surface hardnessresistanceion beam mixing.
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