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硅片抛光工艺质量微细差别的椭偏光谱法鉴别

Characterization of Small Differences in Surface Polishing Quality of Silicon wafers by Spectroscopic Ellipsometry

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【作者】 陈哉; 钱佑华;

【Author】 Chen Zai/Institute of Modern Physics, Fudan University, ShanghaiQian Youhua/Institute of Modern Physics, Fudan University, Shanghai

【机构】 复旦大学现代物理所; 复旦大学现代物理所 上海; 上海;

【摘要】 用椭偏光谱研究了硅片抛光的表面质量.假设一个四相模型,对测量数据进行分析处理.结果表明,(ⅰ)用带间光谱的E1结构,可以分辨表层质量的稍优或稍劣,而不一定要用E2结构.(ⅱ)在E1结构附近,用介电函数的实部B'(hv)区分表层质量的微细差异,似乎比用其虚部B"(hv)效果更佳.

【Abstract】 The surface trace imperfection of silicon wafers resulting from different polishing techno-logies has been quantitatively characterized by use of spectroscopic ellipsometry.The dielectricfunction θ=θ’+iθ" for the residual damaged thin layer at the surface was calculatedfrom the ellipsometric parameters (?),ψon the basis of a four-phase model. Results show that(i) A diagnosis for very small differences between various conventionally adopted polishingprocesses can be feasibly realized in the E1 spectroscopic structure of the silicon interband trans-ition region,rejecting the necessity of E2-structure which emerges from a more shorter UVrange.(ii) It seems that for silicon, a higher sensitivity for the surface imperfection may beobtained with the real part ∈’ of the dielectric function than its imaginary ∈" in the wavelengthrange of E1.

【关键词】 硅; 抛光损伤; 椭偏光谱术;
【Key words】 Silicon; Polishing damage; Spectroscopic ellipsometry;
【基金】 中国科学院科学基金
  • 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1988年02期
  • 【下载频次】43
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