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硅片抛光工艺质量微细差别的椭偏光谱法鉴别
Characterization of Small Differences in Surface Polishing Quality of Silicon wafers by Spectroscopic Ellipsometry
【摘要】 用椭偏光谱研究了硅片抛光的表面质量.假设一个四相模型,对测量数据进行分析处理.结果表明,(ⅰ)用带间光谱的E1结构,可以分辨表层质量的稍优或稍劣,而不一定要用E2结构.(ⅱ)在E1结构附近,用介电函数的实部B'(hv)区分表层质量的微细差异,似乎比用其虚部B"(hv)效果更佳.
【Abstract】 The surface trace imperfection of silicon wafers resulting from different polishing techno-logies has been quantitatively characterized by use of spectroscopic ellipsometry.The dielectricfunction θ=θ’+iθ" for the residual damaged thin layer at the surface was calculatedfrom the ellipsometric parameters (?),ψon the basis of a four-phase model. Results show that(i) A diagnosis for very small differences between various conventionally adopted polishingprocesses can be feasibly realized in the E1 spectroscopic structure of the silicon interband trans-ition region,rejecting the necessity of E2-structure which emerges from a more shorter UVrange.(ii) It seems that for silicon, a higher sensitivity for the surface imperfection may beobtained with the real part ∈’ of the dielectric function than its imaginary ∈" in the wavelengthrange of E1.
- 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1988年02期
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