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聚焦重离子束溅射沉积薄膜
FILM DEPOSITION WITH FOCUSED HEAVY ION BEAM SPUTTERING
【摘要】 本文介绍了聚焦重离子束溅射装置的结构和运行参数。该装置的最高加速电压为10kV,最大离子束流为2mA,蕞小离子束斑为φ1.5mm。利用这台装置,沉积了二十六种金属材料的有衬底薄膜、五种元素的无衬底薄膜和一些稀土氧化物薄膜。研究了单位面积沉积率与靶材质量数的关系。给出了一些升华材料的溅射沉积参数。
【Abstract】 A focused heavy ion beam sputtering apparatus and typical sputtering conditions and characteristics of the apparatus are described. The argon ion beam can be accelerated to maxium energy of 10kev and focused to a minimum diameter of 1.5mm. Beam intensity cau be adjusted continuosly up to 2mA. Foils on substrates, self-supporting foils and rare earth oxide foils were deposited in the apparatus. The deposition rate per unit area is pre sented The puttering conditions of some sublimation material are given.
- 【文献出处】 真空科学与技术 ,Vacuum Science and Technology , 编辑部邮箱 ,1987年02期
- 【被引频次】6
- 【下载频次】74