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离子注入白光退火技术和浅结工艺的研究
A STUDY OF RAPID THERMAL ANNEALING OF IMPLANTATION SAMPLE AND TECHNOLOGY OF SHALLOW JUNCTION
【摘要】 利用白光快速退火设备研究了白光退火特性,得到As通过siO2注入Si制备0.1~0.15μm无缺陷浅结的最佳条件.发现As通过SiO2注入的样品退火后其载流子浓度分布出现双峰现象,进而提出了分析这种现象的增强扩散模型.还发现B+As双注入的样品经瞬态退火后消除了减速场.
【Abstract】 The effects of tungsten-halogen rapid thermal annealing of As-implanted sample and conditions of fabrication of 0.10.3μm shallow junction are stud- ied. The residual defects is observed. So, the shallow junction of 0.1μm free of defects is obtained. It is discovered that the double peak in concentration profile is appeared in As-implanted (through SiO2 film) Si and rapid thermal annealed. And a model of enhanced diffusion is discussed. The retarded field in double-implanted sample disappeared when the sample is rapid thermal annealed.
【关键词】 双重离子注入;
快速热退火;
增强扩散;
浅结;
背散射分析;
【Key words】 double implantation; rapid thermal annealing; enhanced diffusion; shallow junction; backscattering analysis;
【Key words】 double implantation; rapid thermal annealing; enhanced diffusion; shallow junction; backscattering analysis;
【基金】 国家自然科学基金
- 【文献出处】 北京师范大学学报(自然科学版) ,Journal of Beijing Normal University(Natural Science) , 编辑部邮箱 ,1987年03期
- 【被引频次】6
- 【下载频次】30