【摘要】 本文介绍一种简单快速测量硅片表面不平度的方法,可在集成电路的生产过程中直接应用,说明了测量原理、实验验证以及测量结果。这种方法可通过选择不同的光栅常数或衍射级来改变测量的灵敏度,可测量抛光的表面,也可测量粗糙的表面。更多还原

【Abstract】 In this paper a simple and fast method for the measurement of the silicon wafer flatness is described.This method can be directly employed in the production of integrated circuits.Principle of the measuring method,experimental proof and measurement results are given.In this method,the measuring sensitivity can be varied by selecting different grating constam or diffraction order.This method can be applied to polished surfaces and rough surfaces as well.更多还原