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高浓度注砷硅的红外瞬态辐照退火

Transient Annealing of High-Dose As~+-Implanted Silicon with Infrared Irradiation

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【作者】 侯东彦钱佩信李志坚

【Author】 Hou Dongyan/Institute of Microelectronics,Tsinghua UniversityTsien Peihsin/Institute of Microelectronics,Tsinghua UniversityLi Zhijian/Institute of Microelectronics,Tsinghua University

【机构】 清华大学微电子学研究所清华大学微电子学研究所

【摘要】 用高温石墨作为红外辐射源,对高浓度的注砷硅进行了瞬态(13 秒)辐照,达到非常好的退火效果.对于1016cm-2剂量的注砷硅可达到100%的电激活,且损伤恢复比热退火(1100℃,30分)情况要好,引起的注入原子的再分布比常规的高温热退火要小得多.用本方法退火的注砷硅PN结具有良好的电特性。因此,在 VLSI工艺中它是一种很有应用前景的离子注入退火技术.

【Abstract】 High-dose (1016cm-2)As+-implanted silicon wafers are irradiated transiently using aRF heated graphite as an infrared irradiation source.Satisfactory results are obtained:theelectrical activation of the dopants is 100% complete.In contrast with the conventional fur-nace annealing,better recovery of the implantation damage is obtained and the dopant re-distribution is weakened greatly,P-N junctions annealed in this way show good electricalcharacteristics.It is believed that the IR annealing has a good prospect in the applicationof VLSI.

  • 【文献出处】 半导体学报 ,Chinese Journal of Semiconductors , 编辑部邮箱 ,1983年06期
  • 【被引频次】9
  • 【下载频次】27
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