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GaInAsP/InP双异质结液相外延片的p-n结偏位

MISPLACED p-n JUNCTION IN D. H. GaInAsP/InP WAFER GROWN BY LPE

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【作者】 邬祥生杨易陈沛然徐少华李允平胡道珊

【Author】 Wu Xiang-sheng, Yang Yi, Chen Pei-ran, Xu Shao-hua,Li Yun-ping, Hu Dao-shan (Shanghai Institute of Metallurgy, Academia Sinica)

【机构】 中国科学院上海冶金研究所中国科学院上海冶金研究所

【摘要】 用扫描电镜电子束感生电流法研究了GaInAsP/InP双异质结液相外延片的p-n结偏位问题。认为Zn沾污是偏位的主要原因之一。用控制Zn的掺入量或用Mg作p型掺杂剂均可制得正常的p-n结。用电化学c-v法测试了部分样品,并与制管后发射光谱进行比较,结果相同。

【Abstract】 Misplaced p-n junetion in the LPE D. H. GaInAsP/InP wafer is investigated by scanning electron microscope and electron beam-induced current method. It is shown that one of the reasons for the misplaced p-n junetion is Zn contamination. By con-trolling doping level of p-type dopant Zn, or using Mg as p-type dopant, the correctly located p-n junetion is obtained. The locations of the p-n junetion of some samples are measured by electrochemical c-v method. The results obtained are consistent with the emission spectrum of the LED fabricated from the wafers.

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