【摘要】 本文研究了化学镀铜中各种添加剂的作用。对某些含氮基化合物、含氧基化合物、含硫基化合物作为添加剂进行了实验。从实验结果比较了镀液稳定性、析出速度、镀层厚度等特性。从而得出含硫基化合物、含氮基化合物作为添加剂时镀液稳定性好,它们可能和铜离子形成络合物或螯合物,并做了两种添加剂配合使用的镀液稳定性和析出速度实验。另外还探讨了关于添加剂添加量、镀液温度、镀覆时间、镀膜厚度等条件的相互关系。更多还原

【Abstract】 Effects of several kinds of addition agents applied to the electroless copperplating, i. e. , compounds of different radicals containing S, O or N, have been experimentally investigated. Making a comparison between the experimental results of different addition agents, the stabilities of plating solutions, deposition rates and thickness of coppered film are studied characteristically. Adding S or N-containing radical compounds in plating solutions shows the better stability for plating solution. It seems probably that some complexes and chelates are formed by these addition agents with Cu ions. Experiments for evaluating the stabilities of the plating solutions in which S and N containing radical compounds are added together are also performed with determining their deposition rates. Furthermore, the rational amount of addition agents added in plating solution has been discussed in relation to such parameters as the temperature of plating solution, plating time and thickness of coppered film, respectively.更多还原