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提高Nb3Sn的临界电流密度中的一个观点

AN IDEA IN IMPROVING THE CRITICAL CURRENT DENSITY OF Nb3Sn

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【作者】 胡素辉

【Author】 Hu Su-hui (Shanghai Institute of Metallurgy, Academia Sinica)

【机构】 中国科学院上海冶金研究所

【摘要】 和作者于1973年在NbTi44合金中预言的一样,在Nb3Sn的临界电流密度与晶粒大小的依赖关系中也存在一极大值,据此提出了在提高Nb3Sn的临界电流密度中一个值得考虑的观点,这个观点是:除了使Nb3Sn的晶粒大小与磁通线格子参数匹配以外,应作重力求提高Nb3Sn晶界的钉扎强度.

【Abstract】 Since a peak value in the relationship, which is the same as what was predicated in 1973 by the author in NbTi44 alloy, between the Jc and grain size has been also found in Nb3Sn compound, an idea in improving the Jc of Nb3Sn is suggested. That is, besides matching the grain size of Nb3Sn with the flux lattice parameter, the flux pinning strength of the Nb3Sn grain boundary should be as large as possible.

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