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类SCARA硅片搬运机器人的设计理论与性能分析

Design Theory and Performance Analysis of Similar SCARA Wafer Handling Robot

【作者】 管啸天;

【导师】 范顺成;

【作者基本信息】 河北工业大学 , 机械设计及理论, 2018, 博士

【摘要】 硅片搬运设备经历了由人工传输方式到自动传输系统的发展过程,特别是传输机器人技术的应用,使其自动化程度和可靠性得到大幅度提升,因此诞生了专门用于硅片搬运的机器人。但在实际应用中,无论串联形式还是并联形式的硅片搬运机器人都存在着诸多优点与不足之处,而且均不能完全满足当前越来越高的硅片加工要求。为了解决该问题,本文提出了一种新型并联形式的硅片搬运机器人解决方案,并主要针对机器人的关键技术与性能进行了研究和分析,形成了相关设计理论。研究内容如下:(1)构造了一种具有支链嵌套结构的三自由度并联机器人机构,因其实现的运动与SCARA机器人类似,故称之为类SCARA硅片搬运机器人。该机器人具有动平台可连续回转、工作空间较大、运动速度快、精度高和运动解耦等特点。(2)建立了类SCARA硅片搬运机器人机构动平台的运动学方程,并对动平台的位置、速度和加速度进行了分析和运动仿真,仿真结果表明在最大输入速度下,机器人冲击载荷较小,能够实现平稳运动。以动平台的主动臂和从动臂的杆长为对象进行了尺度综合,优化得到了满足约束条件的杆长。(3)建立了类SCARA硅片搬运机器人的动力学模型,通过动态性能仿真分析,得到了伺服电机输出扭矩的变化曲线及变化规律。以机器人动平台为研究对象,建立了其振动系统的动态误差数学模型,分析了等效刚度、转动惯量等参数的变化对动态误差的影响规律,给出了减小动态误差的参数优化建议。(4)分类描述了类SCARA硅片搬运机器人动平台上所涉及的所有几何误差,并分析了它们对终端几何误差的影响,建立了几何误差模型。利用终端几何误差对应的影响系数分析了动平台位姿参数和几何参数的变化对机器人工作精度的影响,为动平台位姿参数和几何参数的合理取值提供了理论依据。(5)研究了基于时间最优的类SCARA硅片搬运机器人运动轨迹规划问题,设计了基于时间最优的轨迹规划算法。应用MATLAB软件进行了算法仿真,得到了光滑平稳的轨迹规划曲线,验证了所提出的轨迹规划算法的合理性。(6)制作了类SCARA硅片搬运机器人试验样机,应用“PC机+运动控制卡”的控制方案设计了机器人的运动控制系统。搭建试验测试系统,对类SCARA硅片搬运机器人的相关设计理论进行了试验验证。以上研究成果与结论为类SCARA硅片搬运机器人的设计提供了理论依据,同时也为类SCARA硅片搬运机器人的实际应用提供了理论指导。

【Abstract】 The wafer handling equipments have undergone the development process from manual transmission to automatic transmission system,especially the application of transmission robot technology,which greatly improves the automation degree and reliability of the equipments,so the wafer-handling robots are designed.However,both the series robots and parallel robots can not fully meet the requirements of the production and processing in practical application.In this paper,a new type of parallel wafer handling robot solution is proposed to solve the problem.The key technologies and performance of robot are researched and analyzed,and the related design theory is formed.The contents of the study are as following:(1)A type of 3-DOF parallel robot manipulator with limbs of embedding structures is designed.Because its motion is similar to that of SCARA robot,it is called the similar SCARA wafer-handling robot,which has characters of moving platform’s continuous rotation,big workspace,fast moving speed,high precision and kinematic decoupling.(2)The kinematics equation of the similar SCARA wafer-handling robot mechanism is established.The position,velocity and acceleration of the mobile platform are analysed and simulated.The results show that in the maximum input speed,the robot impact load is small,and it can achieve smooth movement.Taking the rod length of the master and random arm of the mobile platform as the object,the scale synthesis is carried out,and the rod length satisfying the constraint conditions is optimized.(3)The dynamic model of the similar SCARA wafer-handling robot is established,and the dynamic performance simulation is carried out,and the variation curves and rules of the output torque of the servo motors are obtained.Taking the robot moving platform as the research object,the mathematical model for the dynamic precision of the vibration system is established,and the influence laws of dynamic errors by the change of some parameters such as equivalent stiffness and rotational inertia are analyzed,and the advice of parameters optimization to reduce the dynamic errors are given.(4)All geometric errors involved in the moving platform of the similar SCARA wafer handling robot are described,and the influence of them on the terminal geometric error is analyzed,and the geometric error models are established.The influence of the position and posture parameters and geometric parameters on the working accuracy of the robot is analyzed by using the corresponding influence coefficients of the terminal geometric error,which provides a theoretical basis for the reasonable value of the position and posture parameters and geometric parameters.(5)The problem of trajectory planning of the similar SCARA wafer-handling robot is studied,and the trajectory planning algorithm based on time optimal is designed.The MATLAB software is used to simulate the algorithm,and the smooth and stable trajectory planning curves are obtained.So the rationality of trajectory planning algorithm is verified.(6)The prototype of similar SCARA wafer-handling robot is developed,and the motion control system of the robot is designed by using the control scheme of“PC+motion control card”.The test system is set up to verify the relevant design theories of the similar SCARA wafer-handling robot.The above research results and conclusions provide the theoretical basis for the design of the similar SCARA wafer-handling robot,and also provide theoretical guidance for the robot practical applications.

  • 【分类号】TP242
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