【作者】 余小玲；

【导师】 冯全科；

【作者基本信息】 西安交通大学 ， 动力工程及工程热物理， 2005， 博士

【摘要】 电力电子集成技术将电力电子装置内的大量非标准化的分立器件按照一定的功能组合在一起,形成具有一定通用性的电力电子集成模块。电力电子集成模块的应用使电力电子装置设计和维护难度显著降低,极大地推广了电力电子装置的应用范围。然而,随着集成模块在航空航天以及军事领域的运用越来越广,集成模块的功能要求越来越完善而体积越来越小,在集成模块内产生的高热流密度对模块的可靠性造成巨大威胁,使模块的集成度受到极大限制,甚至认为传热问题成为了模块的集成度向更高方向发展的瓶颈。迄今为止,电力电子集成模块在国外的发展时间只有4～5年,而在国内,电力电子集成模块的研究仅处于起步阶段,还没有对电力电子集成模块进行专门的传热研究,在许多热设计上只能依靠电气工程师自身的经验或模仿国外的热设计结果,这显然不能满足模块发展的要求。因此,针对电力电子集成模块的特殊结构和工作特性,应用传热学的基本理论,对集成模块进行专门的传热研究,对提高模块的集成度,保证模块的工作性能和可靠性,促进电力电子集成模块在国内的自主研发都具有重要意义。本文以具有国际先进水平的混合封装电力电子集成模块为研究对象。该模块的创新之处在于将控制、驱动保护与功率电路封装在一起,具有功率密度大,可靠性高的优点,其传热问题被国内外电力电子专家公认为是急待解决的重要问题之一。重点探索和研究了集成模块内部以及外部风冷散热器的传热规律。建立了集成模块的关键构成部分,也是主要生热部分——功率电路——的稳态和瞬态热模型。根据该热模型分析了评价集成模块热性能的主要参数——模块的结壳热阻——的构成情况和影响因素;并根据研究结果对DBC尺寸、铜基板尺寸等几项关键参数进行优化设计。研究了集成模块内部功率电路对驱动保护电路的热影响,提出在功率电路和驱动保护电路之间夹入一层空气隙以削弱该影响的措施,该项工作提出了模块热分析工作的另一项重要内容。根据增强流动换热的机理以及目前普遍使用的板翅式散热器存在的缺点,提出新型翅柱复合型散热器结构,采用PIV技术对该种带有多钉柱绕流的矩形通道内的流场进行了测试,得到了钉柱位置不同时该种板柱结合的通道内的流动规律,根据流速分布规律并结合湍流数值计算结果,对翅柱式散热器通道内钉柱的位置进行了优化。更多还原

【Abstract】 A large number of discrete devices are integrated in a power electronic module (IPEM) using the power electronic integration technology. The use of the IPEM makes the design and maintenance of a power electronic system much easier and extends the application area of the power electronic system. The next step developing the IPEM is to reduce its size and improve its performance, both of which lead to the high heat flux generated in the module. Therefore, dissipating the huge heat produced becomes the bottleneck of the IPEM development.The IPEM has been developed for 4~5 years up to now in oversea countries, and it is just at the beginning in China. Almost no special thermal study for the IPEM is carried out in China. Thermal designs of IPEMs were carried out by electrical engineers by experience or simulated from foreign products. The current thermal management status of the IPEM obviously couldn’t satisfy its development requirements. Therefore, special thermal study aimed at the special structure and operation characteristics of the IPEM is very important for improving the performance and reliability of the IPEM and accelerating its development speed in our country.The heat transfer of a typical IPEM and the heat transfer in a new type of plate-pin fin heat sink were studied. The 3-dimension steady and transient thermal simulations of the power circuit of the IPEM, which produces most of heat of the module, were developed. The factors affecting on the junction-to-case thermal resistance of the module were studied according to the simulation results, which were verified by experiments. The sizes of direct bonded copper (DBC) board and copper substrate were optimized. The thermal effect of the power circuit on the driver & protection circuit is remarkable when the driver & protection circuit was packaged with the power circuit closely. The method of sandwiching an air gap between the power circuit and the driver & protection circuit was proposed. Experimental results showed that this method is very effective to weaken the thermal effect. A new type of plate-pin fin heat sink (PPFHS) was proposed and the fluid flow and heat transfer in the heat sink were simulated using the standard k ?εturbulent model. The flow field of the flow passages of the PPFHS and the PFHS were measured using the Particle Image Velocimetry (PIV) and the velocity distribution was analyzed. The pin positions of the PPFHS were optimized according to the velocity distribution and the simulation results.更多还原