节点文献
长波长可调谐WDM解复用光接收集成器件及其关键制备工艺的研究
Research on Long-Wavelength, Tunable Photodetector and Its Key Fabrication Technologies for WDM Demultiplexing Receiving Application
【作者】 王兴妍;
【导师】 任晓敏;
【作者基本信息】 北京邮电大学 , 电磁场与微波技术, 2006, 博士
【摘要】 目前,随着波分复用技术和全光网的发展,研制既具有波长选择能力、窄光谱响应线宽、高速响应和高灵敏度,又能够实现探测波长大范围调谐的新型长波长集成解复用接收器件已成为当今光电子集成器件领域的一个新热点。 本论文围绕任晓敏教授任首席科学家的973计划项目(No:2003CB314900)以及课题组所承担的国家863重大基金项目(No:2003AA31g050、2003AA312020)、国家自然科学基金重大项目(No:90201035)、国家自然科学基金重大研究计划项目(No:90104003)和国家自然科学基金资助项目(No:60576018)展开的。针对光电子集成中的关键制备工艺、基于特殊功能微结构的新型WDM集成解复用接收器件的研制等开展了大量研究工作,并已取得以下主要研究成果: 1.发明了一种基于硫化物表面处理的GaAs/InP低温晶片键合技术,并首次成功实现了GaAs/InP基晶片间简单、无毒性的低温(360℃)键合。键合强度达到了MPa级,超过晶片本身的断裂强度,X射线衍射(XRD)和光荧光谱(PL)分析表明键合后晶体质量保持完好,二次离子质谱(SIMS)分析表明键合界面存在约29nm厚的硫化物层,X光电子能谱(XPS)测试表明高的键合强度是因为在晶片界面存在稳定的S-Ga和S-In键。该研究成果已申请了一项新的发明专利。 2.利用上述低温晶片键合的工艺流程,成功实现了GaAs基F-P腔滤波器与InP基探测器结构之间的准单片集成。并实现了InP基InAsP/InGaAsP多量子阱(MQW)结构与GaAs基GaAs/AlGaAs分布式布拉格反射镜(DBR)间的低温晶片键合,这为实现低温键合的长波长垂直腔面发射激光器(VCSEL)打下了基础。
【Abstract】 With the rapid development of WDM optical communications, integrated optoelectronic devices have attracted tremendous attention. A novel kind of integrated devices, featuring the wavelength-selective detection, high-speed, high sensitivity and wide tuning range has many applications.The research in this paper is supported by grants from The National Basic Research Program of China (No.2003CB314902), The National High Technology Research and Development Program of. China(No: 2003AA31g050 and 2003AA312020), Key Program project of the National Natural Science Foundation of China (No.90201035), Major Research Plan Program of the National Natural Science Foundation of China(No.90104003) and the project of the National Natural Science Foundation of China (No: 60576018). In this thesis, a great deal of research work can be described as follow: fabrication processes of special functional microstructures and its applications in integrated optoelectronic devices, designing and fabrication of novel WDM integrated demultiplexing photodetectors. The main achievements are listed as follows.1. An approach for GaAs/InP wafer bonding based on thiourea treatment was presented which is simple and non-toxic. And
【Key words】 WDM demultiplexing receiving device; resonant cavity enhanced (RCE) photodetector; low temperature wafer bonding; InP/Air gap DBR; dynamic Etch Mask Technique; one-mirror inclined three-mirror cavity (OMITMiC);